GBC Swingline 3mil UltraClear Letter Size Thermal Laminating Pouches 100pk - 3745022B
41.49 NewCondition InStock

GBC Swingline 3mil UltraClear Letter Size Thermal Laminating Pouches 100pk - 3745022B

Part #: 3745022
Brand: GBC
  • Size: Letter
  • Thickness: 3 mil
  • Finish: Gloss
  • Heat Required: Yes
  • Price Match Guarantee
  • Ships Free Over $75

$41.49

FREE shipping for orders over $75*

SWIPE FOR MORE IMAGES
  • 0
  • 1
  • 2
  • 3
video

Product Description

These 3mil GBC Fusion UltraClear Letter Size Laminating Pouches boast new and improved clarity that keeps your laminated documents looking clean and crisp. Thermally activated, the 3mil pouches measure 9" x 11.5", making them perfect for your letter size (8.5" x 11") documents. You'll get 100 pouches with every order. Product number 3745022.

Product Details

  • Thickness: 3mil
  • Quantity: 100 pouches
  • Size: Letter Size
  • Dimensions: 8.5" x 11"
  • Product Number: 3745022

Demonstration Video

GBC Swingline 3mil UltraClear Letter Size Thermal Laminating Pouches

Transcript: Welcome to MyBinding.com. These are the UltraClear 3mil Letter Size Thermal Laminating Pouches from GBC Swingline.

These pouches boast improved clarity to keep your documents looking clean and crisp. Just align your page inside the pouch, and insert weld first into your pouch laminator. They’re sized for 8.5x11” documents and the 3mil thermally activated material has flexibility without sacrificing protection.

For more videos and all your binding needs, go to MyBinding.com.
Welcome to MyBinding.com. These are the UltraClear 3mil Letter Size Thermal Laminating Pouches from GBC Swingline.

These pouches boast improved clarity to keep your documents looking clean and crisp. Just align your page inside the pouch, and insert weld first into your pouch laminator. They’re sized for 8.5x11” documents and the 3mil thermally activated material has flexibility without sacrificing protection.

For more videos and all your binding needs, go to MyBinding.com.

Questions & Answers

Submit a New Question